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| Regional areas: | 3-4 business days |
| Remote areas: | 3-5 business days |
Suction pumps are used to suck away molten solder, leaving previously joined terminals disconnected. They are primarily used to release through-hole connections from a PCB.
The large capacity spring-loaded plunger quickly removes moulten solder in a single action. The tool easily disassembles for fast cleaning, tip and "O" ring replacement. Internal plunger pin automatically purges solder from tip with each use.
Desoldering requires using a soldering iron to heat the solder joint enough to melt the solder and then removing the molten solder by suction so that the joint may be separated from the component.
Beware of applying heat with solder iron for to long, as it can cause the bond between the printed circuit trace and the board substrate to fail.
